There are rumors that the AMD Ryzen 9000X3D reverses the 3D stack hierarchy – the L3 cache block is supposedly located below the CCDs

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In two weeks, AMD will present its own Ryzen 9000X3D chips that will compete with best processors on the market. Hardware leak HXL on the X explained some of the architectural differences between the first and second generations and why AMD can achieve better thermal performance and higher clock speeds on the Ryzen 9000X3D. It has been claimed that AMD is inverting its 3D die stacking structure and the SRAM block is now placed underneath the CCDs.

When AMD first released its Ryzen 5000X3D chips, the concept was to stack a block of L3 cache on top of CCD drives. A big problem with this model was heat dissipation due to the use of additional silicon in the CCDs to ensure structural integrity. This thermal limitation also limited AMD’s ability to overclock these processors. However, this issue appears to have been resolved with the Ryzen 9000X3D as the CCD is reported to be located on top of the cache die. If true, AMD’s new design will be a true engineering marvel – both from an architecture and packaging perspective.

We don’t currently have any diagrams for these processors, and we’re not sure how AMD will handle the potential Y-axis hit compared to a non-X3D Ryzen 9000. However, this change was expected because Zen 5-based CCDs have a much smaller internal L3 block size than Zen 4. This meant that any potential external dies (via 3D stacking) would overlap the CCDs and cause heat dissipation issues. High efficiency Chip analysis showed that a likely solution would be to use 2-Hi 3D cache stacking, but AMD surprised us all with a completely different approach.

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It will be intriguing to see how AMD implements such an arrangement, and we hope that Team Red will bless us with an in-depth review. From this leak, it appears that in the Ryzen 9000X3D chips, the CCD will have direct contact with the IHS without additional silicon, which will improve thermal performance.

Since then, this has spelled trouble for Intel Ultra9 core 285kthe flagship Arrow Lake chip, it does not even beat the last generation systems Ryzen 7 7800X3D. The Ryzen 9000X3D series will debut on November 7 retailer lists listed the Ryzen 7 9800X3D at $484-$525.